Understanding Semiconductors: Modern Metrology from Lab to Fab
by Rigaku
December 7, 2022 7:00 am
Understanding Semiconductors: Modern Metrology from Lab to Fab, is a podcast for engineering leaders in characterization, metrology, process, and analytics, looking for discussion around semiconductor metrology challenges. Each episode will feature a conversation with technology experts about problems facing the semiconductor metrology industry.
Welcome to Understanding Semiconductors! Here is part two of Markus’ conversation with Suman Datta. This episode is a thorough examination of his current research and how metrology envisions the Path Beyond CMOS:
What’s going to change in the transistor structure in the future?
The importance of power delivery
How to utilize the front and backside for vertical scaling?
Using a representative stack and metrology and correlating it to real-world performance
What’s the penalty from the bonding approach?
The importance of reliability is a function of not only the material, but also the use case
Suman is the Joseph M Pettit Chair of Advanced Computing and Georgia Research Alliance (GRA), an Eminent Scholar, and a Professor in the School of Electrical & Computer Engineering at Georgia Tech. His research group focuses on semiconductor devices that enable new computing models such as in-memory computing, brain-inspired computing, cryogenic computing, resilient computing, etc. (source)
Reach out to Markus for any potential guest requests or episode ideas here: https://www.linkedin.com/in/markus-kuhn-4b502110/
For the latest in new Metrology Techniques and Solutions check out https://rsmd.rigaku.com/
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